How Many Wafers Can Be Cut From A Single Boule?

(Correct Answer Below)

How Many Wafers Can Be Cut From A Single Boule?

linders called "boules" that are 300 mm in diameter and 2 m in length,as shown.(Figure 1) The density of silicon is 2.33 g/cm3. Silicon wafers for making integrated circuits are sliced from a 2.0 m boule and are typically 0.75 mm thick and 300. mm in diameter. How many wafers can be cut from a single boule?
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1000mm = 1 m 2m * 1000mm / 1m = 2000 mm 2000mm / .75mm = 2666.67 = 2700 wafers

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